W3X3.9A — 3x3 Array 9 Ball Wafer Level Chip Scale Package (For ISL59116, ISL59117 Only) ……
W3X2.6C — 3x2 Array 6 Ball Wafer Level CSP (for ISL28138C, ISL28136C, EL8176, EL8178) ……
W2X2.4 — 2x2 Array 4 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch) ……
MDP0048 — HTSSOP Heatsink TSSOP Package Family ……
MDP0044 — TSSOP Thin-Shrink Small Outline Package Family ……
M8.173 — 8 Lead Thin Shrink Small Outline Package ……
intersil的M48.240A — 48铅细收缩轮廓封装（TSSOP） Plastic Packag……
M48.240 — 48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) ……
M38.173C — 38 Lead Heat-Sink Thin Shrink Small Outline Plastic Package (HTSSOP) ……
M38.173B — 38 Lead Thin Shrink Small Outline Exposed Pad Plastic Package ……
